PCB Manufacturer Capabilities | |||
Items | Capabilities | ||
Material | Normal Tg FR4(Halogen free) | Shengyi S1150 | |
High Tg FR4(Halogen free) | Shengyi S1165, IT140G | ||
High Tg FR4 | Common: ITEQ:IT-180A; Shengyi: S1000-2 Purchase: FR408、FR408HR、IS410、FR406、PCL-370HR、IT-150DA; |
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Ceramic Particle Filled Laminates | Common: Rogers:Rogers4350、Rogers4003 Purchase: Arlon:25FR、25N; |
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PCB type | Rigid PCB | Back board、Multi blind and burried、High copper board | |
Buildings | Blind&buried via type | Laminating≤3 times | |
HDI PCB | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(burried vias≤0.3mm) | ||
Finish treatment | Lead free | Flash gold、ENIG、Hard gold、HAL-Lead Free、OSP、gold fingers 、immersion silver、immersion tin | |
aspect ratio | 8:01 | ||
Max finished size | HAL Leaded 22"*39";Hal Lead Free 22"*24";Gold fingers 24"*24";Hard gold 24"*28";ENIG 21"*27";Flash Gold 21"*48";immersion tin 16"*21";immersion silver 16"*18";OSP 24"*40"; | ||
MIN finished size | HAL Leaded 5"*6";Hal Lead Free 10"*10";Gold fingers 12"*16";Hard gold3"*3";Flash Gold 8"*10";immersion tin 2"*4";immersion silver2"*4";OSP2"*2"; | ||
PCB thickness | HAL Leaded0.6-4.0mm;Hal Lead Free0.6-4.0mm;Gold fingers 1.0-3.2mm;Hard gold0.1-5.0mm;ENIG 0.4-7.0mm;Flash gold 0.4-5.0mm;immersion tin 0.4-5.0mm;immersion silver 0.4-5.0mm;OSP0.2-6.0mm; | ||
MAX high to gold finger | 1.5inch | ||
Min space between gold fingers | 6mil | ||
Min block space to gold fingers | 7.5mi | ||
Max lamination cycle | 3 times | ||
Min laser drill for stacked via | 0.1mm | ||
Min stacked via pad size | 0.3mm | ||
HDI | Max laser drilling size | 0.15mm | |
Blind Via Finished Hole Size | 0.3mm | ||
Buried Via Finished Hole Size | 0.3mm | ||
Non Conductive Filled Vias | 0.2mm~0.8mm | ||
Conductive Filled Vias | 0.2~0.8mm | ||
Surface Finishes/coating thickness | ENIG (Electroless Nickel/Immersion Gold) | AU: 0.05~0.1um Nickel: 3~5um | |
Hard gold | 0.1~1.0um | ||
Lead Free HASL | 2~40um | ||
Flash gold(electroplated gold) | Au 0.025-0.10um,Nickel 3~5um | ||
electroplated Gold finger | Au 0.25-1.0um Nickel 3~5um | ||
Selective Gold | Au 0.25-1.0um Nickel 3~5um | ||
Immersion Silver | 0.2~0.4um | ||
Soldermask | min. 8um, max. 30um | ||
Hole to Space | Min mechanical hole | 0.2mm | |
Finshed mechanical hole size | 0.1~6.0mm | ||
MAX aspect ratio for Hole | 8:01 | ||
Min space between holes and conductor | 8mil | ||
Min space bwteen hole walls in different net | 12mil | ||
Min space bwteen hole walls in same net | 8mil | ||
Min space bwteen NPTH hole walls | 10mil | ||
Hole location tolerance | +/-3mil | ||
NPTH tolerance | +/-0.05mm | ||
Pressfit holes tolerance | +/-0.05mm | ||
Countersink depth tolerance | +/-0.15mm | ||
Countersink hole size tolerance | +/-0.15mm | ||
Pad(ring) | Min Pad size for mechanical drilling | 0.4mm | |
Min BGA pad size | 0.25mm | ||
Pad size tolerance(BGA) | +/-2mil | ||
Pitch | Min lead pitch | 0.35mm | |
Min BGA ball pitch | 0.35mm | ||
Min Width/ Min Space | Internal Layer | 1/3OZ: N/A | |
1/2OZ: 4/4mil | |||
1OZ: 4/4mil | |||
2OZ: 5/5mil | |||
External Layer | 1/3OZ: 4/4mil | ||
1/2OZ:4/4mil | |||
1OZ: 4.5/4.5mil | |||
2OZ: 7/7mil | |||
Width tolerance | ≤10mil:+/-2mil | ||
>10mil:+/-20% | |||
General Space(External/Internal) | Min copper pour to Pour eg. 4 mils /3 mils | 8mil | |
Min copper pour to trace | 6mil | ||
Min copper pour to microvia | 8mil | ||
Min copper pour to buired via | 8mil | ||
Min copper pour to SMD Pad | 6mil | ||
Min copper pour to PTH Pad | 6mil | ||
Solder mask | Soldermask color | Gloss Green\Matte Green\Black\Red\Blue\Yellow | |
Solder Mask Min Dam Size | 4mil(0.1mm) for 1oz final copper with Green mask, others need 6mil(0.15mm) min. | ||
Solder Mask Min Dam Size in BGA Area | 4mil | ||
Solder Mask Registration | +/-3mil | ||
Silkscreen color | White,, black | ||
Min. Diameter Rout Cutter Available | 0.8mm | ||
Routed Part Size Tolerance | +/-0.15mm | ||
Router | V-CUT symmetrical tolerance | +/-0.13mm | |
MAX V-CUT lines | 80 lines | ||
V-CUT angle tolerance | +/-5 degress | ||
V Score, Edge to Copper | H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°); 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); 2.4<H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); |
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V-CUT angle | 20、30、45 degree | ||
Gold finger bevelling | 20、30、45、60 degree | ||
Gold finger bevelling tolerance | +/-5 degree | ||
Min space of gold finger chamfering noninterference tab | 6mm | ||
Min gap between the side of gold finger and the shape edge line |
8mil | ||
Depth tolerance of depth-control groove milling | +/-0.15mm | ||
routing tolerance (edge to edge) | +/-0.1mm | ||
Min tolerance for routing slot˄PTH˅ | +/-0.15mm | ||
Min tolerance for routing slot ˄NPTH˅ |
+/-0.15mm | ||
Min tolerance for drilling slot˄PTH˅ | +/-0.15mm | ||
Min tolerance for drilling slot ˄NPTH˅ |
+/-0.15mm | ||
Routed Array | +/-0.13mm | ||
Edge Plating | +/-0.15mm | ||
Edge Castellation | +/-0.15mm | ||
Metal- substrate PCB | Layer counts | 1~6 layer | |
PCB size (Finished) | MAX:610*610mm、MIN:5*5mm | ||
PCB thickness(Finished) | 0.5-5.0mm | ||
Copper thickness(Finished) | 0.5-10 OZ | ||
Min Dielectric | 75um | ||
Min Core Thickness | 0.5um | ||
Min finished hole size&tolerance | NPTH:0.5±0.05mm;PTH:1.0±0.1mm; | ||
Dimension tolerance | ±0.05mm | ||
PCB partial surface treatment | Hal Leaded and Lead Free;OSP;ENIG;Flash gold; Hard gold | ||
Metal partial surface treatment | Copper:Flash gold;Al:Anodic oxidation | ||
Material | T-110、T-111;VT-4A1、VT-4A2、VT-4A3,1KA04、1KA06, MP06503、HT04503); | ||
Others | Layer count | 1~20 layer | |
PCB thickness | 0.4~6..0mm | ||
PCB thickness tolerance˄Normal ˅ |
Thickness : ±10%(>1.0mm);±0.1mm(≤1.0mm); | ||
PCB thickness tolerance˄Special ˅ | Thickness ±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm) | ||
Min bow&twist | 0.75% | ||
Controlled Impedance Tolerance | +/-10% | ||
Bare Board Electrical Testing | Testing methods | Flying probe testing, Test fixture | |
Quality | Quality standards | IPC II, IPC III | |
RMA | RMA Process | ERP system | |
Deliverables | Gerber format requirement RS274X or ODB++? | YES | |
EQ/DFM support within 1-2 Working days ? | YES |
Dewell Electronics Co., Ltd. http://www.dewell-pcb.com Phone: 86-180 2805 6029
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