Rigid PCB capability

PCB Manufacturer Capabilities
Items		Capabilities
Material	Normal Tg FR4(Halogen free)	Shengyi S1150
	High Tg FR4(Halogen free)	Shengyi S1165, IT140G
	High Tg FR4	Common: ITEQ:IT-180A; Shengyi: S1000-2 Purchase: FR408、FR408HR、IS410、FR406、PCL-370HR、IT-150DA；
	Ceramic Particle Filled Laminates	Common: Rogers：Rogers4350、Rogers4003 Purchase: Arlon:25FR、25N;
PCB type	Rigid PCB	Back board、Multi blind and burried、High copper board
Buildings	Blind&buried via type	Laminating≤3 times
	HDI PCB	1+n+1、1+1+n+1+1、2+n+2、3+n+3(burried vias≤0.3mm)
Finish treatment	Lead free	Flash gold、ENIG、Hard gold、HAL-Lead Free、OSP、gold fingers 、immersion silver、immersion tin
	aspect ratio	8:01
	Max finished size	HAL Leaded 22"39"；Hal Lead Free 22"24"；Gold fingers 24"24"；Hard gold 24"28"；ENIG 21"27"；Flash Gold 21"48"；immersion tin 16"21"；immersion silver 16"18"；OSP 24"*40"；
	MIN finished size	HAL Leaded 5"6"；Hal Lead Free 10"10"；Gold fingers 12"16"；Hard gold3"3"；Flash Gold 8"10"；immersion tin 2"4"；immersion silver2"4"；OSP2"2"；
	PCB thickness	HAL Leaded0.6-4.0mm；Hal Lead Free0.6-4.0mm；Gold fingers 1.0-3.2mm；Hard gold0.1-5.0mm；ENIG 0.4-7.0mm；Flash gold 0.4-5.0mm；immersion tin 0.4-5.0mm；immersion silver 0.4-5.0mm；OSP0.2-6.0mm；
	MAX high to gold finger	1.5inch
	Min space between gold fingers	6mil
	Min block space to gold fingers	7.5mi
	Max lamination cycle	3 times
	Min laser drill for stacked via	0.1mm
	Min stacked via pad size	0.3mm
HDI	Max laser drilling size	0.15mm
	Blind Via Finished Hole Size	0.3mm
	Buried Via Finished Hole Size	0.3mm
	Non Conductive Filled Vias	0.2mm~0.8mm
	Conductive Filled Vias	0.2~0.8mm
Surface Finishes/coating thickness	ENIG (Electroless Nickel/Immersion Gold)	AU： 0.05~0.1um Nickel: 3~5um
	Hard gold	0.1~1.0um
	Lead Free HASL	2~40um
	Flash gold(electroplated gold)	Au 0.025-0.10um，Nickel 3~5um
	electroplated Gold finger	Au 0.25-1.0um Nickel 3~5um
	Selective Gold	Au 0.25-1.0um Nickel 3~5um
	Immersion Silver	0.2~0.4um
	Soldermask	min. 8um, max. 30um
Hole to Space	Min mechanical hole	0.2mm
	Finshed mechanical hole size	0.1~6.0mm
	MAX aspect ratio for Hole	8:01
	Min space between holes and conductor	8mil
	Min space bwteen hole walls in different net	12mil
	Min space bwteen hole walls in same net	8mil
	Min space bwteen NPTH hole walls	10mil
	Hole location tolerance	+/-3mil
	NPTH tolerance	+/-0.05mm
	Pressfit holes tolerance	+/-0.05mm
	Countersink depth tolerance	+/-0.15mm
	Countersink hole size tolerance	+/-0.15mm
Pad(ring)	Min Pad size for mechanical drilling	0.4mm
	Min BGA pad size	0.25mm
	Pad size tolerance(BGA)	+/-2mil
Pitch	Min lead pitch	0.35mm
	Min BGA ball pitch	0.35mm


Min Width/ Min Space	Internal Layer	1/3OZ: N/A
		1/2OZ: 4/4mil
		1OZ: 4/4mil
		2OZ: 5/5mil
	External Layer	1/3OZ: 4/4mil
		1/2OZ:4/4mil
		1OZ: 4.5/4.5mil
		2OZ: 7/7mil
	Width tolerance	≤10mil：+/-2mil
		＞10mil：+/-20%
General Space(External/Internal)	Min copper pour to Pour eg. 4 mils /3 mils	8mil
	Min copper pour to trace	6mil
	Min copper pour to microvia	8mil
	Min copper pour to buired via	8mil
	Min copper pour to SMD Pad	6mil
	Min copper pour to PTH Pad	6mil


Solder mask	Soldermask color	Gloss Green\Matte Green\Black\Red\Blue\Yellow
	Solder Mask Min Dam Size	4mil(0.1mm) for 1oz final copper with Green mask, others need 6mil(0.15mm) min.
	Solder Mask Min Dam Size in BGA Area	4mil
	Solder Mask Registration	+/-3mil
	Silkscreen color	White,, black
	Min. Diameter Rout Cutter Available	0.8mm
	Routed Part Size Tolerance	+/-0.15mm
Router	V-CUT symmetrical tolerance	+/-0.13mm
	MAX V-CUT lines	80 lines
	V-CUT angle tolerance	+/-5 degress
	V Score, Edge to Copper	H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°); 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°);
	V-CUT angle	20、30、45 degree
	Gold finger bevelling	20、30、45、60 degree
	Gold finger bevelling tolerance	+/-5 degree
	Min space of gold finger chamfering noninterference tab	6mm
	Min gap between the side of gold finger and the shape edge line	8mil
	Depth tolerance of depth-control groove milling	+/-0.15mm
	routing tolerance (edge to edge)	+/-0.1mm
	Min tolerance for routing slot˄PTH˅	+/-0.15mm
	Min tolerance for routing slot ˄NPTH˅	+/-0.15mm
	Min tolerance for drilling slot˄PTH˅	+/-0.15mm
	Min tolerance for drilling slot ˄NPTH˅	+/-0.15mm
	Routed Array	+/-0.13mm
	Edge Plating	+/-0.15mm
	Edge Castellation	+/-0.15mm
Metal- substrate PCB	Layer counts	1~6 layer
	PCB size (Finished)	MAX:610610mm、MIN:55mm
	PCB thickness(Finished)	0.5-5.0mm
	Copper thickness(Finished)	0.5-10 OZ
	Min Dielectric	75um
	Min Core Thickness	0.5um
	Min finished hole size&tolerance	NPTH：0.5±0.05mm；PTH：1.0±0.1mm；
	Dimension tolerance	±0.05mm
	PCB partial surface treatment	Hal Leaded and Lead Free；OSP；ENIG；Flash gold； Hard gold
	Metal partial surface treatment	Copper：Flash gold；Al：Anodic oxidation
	Material	T-110、T-111；VT-4A1、VT-4A2、VT-4A3,1KA04、1KA06, MP06503、HT04503）；
Others	Layer count	1~20 layer
	PCB thickness	0.4~6..0mm
	PCB thickness tolerance˄Normal ˅	Thickness : ±10%(＞1.0mm)；±0.1mm(≤1.0mm)；
	PCB thickness tolerance˄Special ˅	Thickness ±0.1mm（≤2.0mm）；±0.15mm（2.1-3.0mm）
	Min bow&twist	0.75%
	Controlled Impedance Tolerance	+/-10%

Bare Board Electrical Testing	Testing methods	Flying probe testing, Test fixture
Quality	Quality standards	IPC II, IPC III
RMA	RMA Process	ERP system
Deliverables	Gerber format requirement RS274X or ODB++?	YES
	EQ/DFM support within 1-2 Working days ?	YES